Manufacturer:
Attachment Method:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Natural:
Image Part Manufacturer Description MOQ Stock Action
960-19-12-S-AB-0 Wakefield Thermal
HEATSINK 19X12MM S...
1
200
In-stock
Get Quote
960-19-12-D-AB-0 Wakefield Thermal
HEATSINK 19X12MM D...
1
7
In-stock
Get Quote
960-19-12-F-AB-0 Wakefield Thermal
HEATSINK 19X12MM F...
1
35,000
In-stock
Get Quote
HSB07-202009 CUI Devices
HEAT SINK, BGA, 20 ...
1
35,000
In-stock
Get Quote
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