Power Dissipation @ Temperature Rise:
Thermal Resistance @ Natural:
Image Part Manufacturer Description MOQ Stock Action
HSB27-434316 CUI Devices
HEAT SINK, BGA, 43....
1
1,081
In-stock
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HSB21-454515 CUI Devices
HEAT SINK, BGA, 45 ...
1
35,000
In-stock
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