- Manufacturer:
-
- Ohmite (1)
- Attachment Method:
-
- Material:
-
- Material Finish:
-
- Package Cooled:
-
- Power Dissipation @ Temperature Rise:
-
4 Records
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
|
Ohmite | HEATSINK AND CLI... |
1 |
426
In-stock
|
Get Quote | ||
|
ASSMANN WSW Components | HEATSINK ALUM AN... |
1 |
1,177
In-stock
|
Get Quote | ||
|
ASSMANN WSW Components | HEATSINK ALUM AN... |
1 |
495
In-stock
|
Get Quote | ||
|
NTE Electronics, Inc. | HEATSINK FOR PLA... |
1 |
74
In-stock
|
Get Quote |