- Attachment Method:
-
- Package Cooled:
-
- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Natural:
-
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
|
Wakefield Thermal | HEATSINK 5.5X5X2.5" ... |
1 |
102
In-stock
|
Get Quote | ||
|
Wakefield Thermal | HEAT SINK C2026 REV... |
1 |
95
In-stock
|
Get Quote |