- Manufacturer：
-
- CUI Devices (2)
- Material：
-
- Material Finish：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Natural：
-
6 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, BGA, 25 ... |
1 |
1,433
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 27 ... |
1 |
239
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 300X... |
1 |
9
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | PCIE EXTRUSION P... |
1 |
2
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | PCIE EXTRUSION P... |
1 |
35,000
In-stock
|
Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 1220... |
1 |
3
In-stock
|
Get Quote |
