- Manufacturer:
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- CUI Devices (1)
- Attachment Method:
-
- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Product Status:
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- Thermal Resistance @ Natural:
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Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
|
CUI Devices | HEATSINK TO-220 4.6W... |
1 |
35,000
In-stock
|
Get Quote | ||
![]() |
TE Connectivity AMP Connectors | 35MM HS ASSY ULTEM... |
1 |
35,000
In-stock
|
Get Quote | ||
![]() |
TE Connectivity AMP Connectors | 35MM HS ASSY PPA C... |
2 |
35,000
In-stock
|
Get Quote | ||
![]() |
TE Connectivity AMP Connectors | 37.5MM HS ASSY ULTE... |
1 |
35,000
In-stock
|
Get Quote |