Thermal - Heat Sinks - IC-FPGACHIP

Attachment Method：

Package Cooled：

Power Dissipation @ Temperature Rise：

Shape：

Thermal Resistance @ Natural：

Type：

Filter：

3 Records

Part	Manufacturer	Description	MOQ		Stock	Action
CS8672520B0	Cooling Source	25X25 X20MM	1	PDF	35,000 In-stock	Get Quote
HSS-B20-061H-03	CUI Devices	HEATSINK TO-220 2.9W...	55	PDF	35,000 In-stock	Get Quote
903-23-2-12-2-B-0	Wakefield Thermal	HEAT SINK PIN FIN...	270	PDF	35,000 In-stock	Get Quote

1 / 1 Page, 3 Records