- Manufacturer:
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- CUI Devices (2)
- Attachment Method:
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- Material:
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- Material Finish:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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3 Records
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEATSINK TRIPLE ... |
1 |
7,993
In-stock
|
Get Quote | ||
|
CUI Devices | HEATSINK TO-220 4.1W... |
1 |
333
In-stock
|
Get Quote | ||
|
CUI Devices | HEATSINK TO-220 4.1W... |
1 |
376
In-stock
|
Get Quote |