- Manufacturer:
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- CUI Devices (1)
- Attachment Method:
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- Material:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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7 Records
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, BGA, 23 ... |
1 |
5,589
In-stock
|
Get Quote | ||
|
Wakefield Thermal | HEATSINK 19X15MM F... |
1 |
225
In-stock
|
Get Quote | ||
|
Wakefield Thermal | HEATSINK 19X15MM S... |
1 |
89
In-stock
|
Get Quote | ||
|
Wakefield Thermal | HEATSINK 19X15MM D... |
1 |
35,000
In-stock
|
Get Quote | ||
|
Wakefield Thermal | HEATSINK 23X12MM F... |
1 |
35,000
In-stock
|
Get Quote | ||
|
Wakefield Thermal | HEATSINK 23X12MM D... |
1 |
35,000
In-stock
|
Get Quote | ||
|
Wakefield Thermal | HEATSINK 23X12MM S... |
400 |
35,000
In-stock
|
Get Quote |