- Manufacturer:
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- CUI Devices (1)
- Material:
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- Material Finish:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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3 Records
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 300X... |
1 |
299
In-stock
|
Get Quote | ||
|
CUI Devices | HEAT SINK, BGA, 23 ... |
1 |
5,589
In-stock
|
Get Quote | ||
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Advanced Thermal Solutions, Inc. | HEATSINK AL6063 1220... |
1 |
6
In-stock
|
Get Quote |