- Manufacturer:
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- Cooling Source (1)
- CUI Devices (1)
- Attachment Method:
-
- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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- Type:
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Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
|
Cooling Source | 30X30X10MM |
1 |
32
In-stock
|
Get Quote | ||
|
CUI Devices | HEATSINK TO-220 4.1W... |
8,000 |
35,000
In-stock
|
Get Quote |