- Manufacturer:
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- CUI Devices (1)
- Material:
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- Material Finish:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK TO-263 CO... |
9,000 |
35,000
In-stock
|
Get Quote | ||
![]() |
TE Connectivity AMP Connectors | HS ASSY CLIP |
1 |
35,000
In-stock
|
Get Quote |