- Manufacturer:
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- Comair Rotron (1)
- Attachment Method:
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- Material:
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- Material Finish:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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2 Records
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
|
Wakefield Thermal | HEATSINK CPU 25MM... |
1 |
35,000
In-stock
|
Get Quote | ||
|
Comair Rotron | HEATSINK STAMP 13... |
1 |
35,000
In-stock
|
Get Quote |