- Manufacturer：
-
- Aavid (6)
- CUI Devices (1)
- Attachment Method：
-
- Material：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
8 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Aavid | HEATSINK TO-220 TA... |
1 |
13,282
In-stock
|
Get Quote | ||
|
|
Aavid | HEATSINK TO-220 W/T... |
1 |
7,590
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
2,208
In-stock
|
Get Quote | ||
|
|
Aavid | BOARD LEVEL HEAT... |
1 |
1,936
In-stock
|
Get Quote | ||
|
|
Aavid | BOARD LEVEL HEAT... |
8,000 |
35,000
In-stock
|
Get Quote | ||
|
Aavid | BOARD LEVEL HEAT... |
1,000 |
35,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEAT SINK ELLIP F... |
270 |
35,000
In-stock
|
Get Quote | ||
|
|
Aavid | BOARD LEVEL HEAT... |
1 |
35,000
In-stock
|
Get Quote |
