- Attachment Method：
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- Material：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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3 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
ASSMANN WSW Components | HEATSINK CPU XCU... |
1 |
6,099
In-stock
|
Get Quote | ||
|
|
ASSMANN WSW Components | HEAT SINK ANOD AL... |
1 |
660
In-stock
|
Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK ALUM AN... |
1 |
3,970
In-stock
|
Get Quote |
