- Attachment Method：
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- Material：
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- Material Finish：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Type：
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10 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
ASSMANN WSW Components | HEATSINK CPU FOR... |
1 |
1,037
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK POWER T... |
1 |
489
In-stock
|
Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK CPU FOR... |
1 |
1,535
In-stock
|
Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK CPU FOR... |
1 |
1,544
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-3 BLA... |
1 |
825
In-stock
|
Get Quote | ||
|
|
Aavid | HEATSINK TO-3 H31.7... |
1 |
359
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-3 BLA... |
1 |
272
In-stock
|
Get Quote | ||
|
|
Ohmite | BGA HEATSINK W/TA... |
1 |
2
In-stock
|
Get Quote | ||
|
Aavid | BOARD LEVEL HEAT... |
3,000 |
35,000
In-stock
|
Get Quote | ||
|
|
Aavid | BOARD LEVEL HEAT... |
1 |
35,000
In-stock
|
Get Quote |
