- Manufacturer:
-
- Attachment Method:
-
- Material Finish:
-
- Package Cooled:
-
- Thermal Resistance @ Forced Air Flow:
-
3 Records
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
|
ASSMANN WSW Components | HEATSINK ALUM AN... |
1 |
2,174
In-stock
|
Get Quote | ||
|
Advanced Thermal Solutions, Inc. | PCIE EXTRUSION P... |
1 |
49
In-stock
|
Get Quote | ||
|
Advanced Thermal Solutions, Inc. | PCIE EXTRUSION P... |
1 |
52
In-stock
|
Get Quote |