- Manufacturer：
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- CUI Devices (1)
- Malico Inc. (1)
- Attachment Method：
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- Material：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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3 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
2,992
In-stock
|
Get Quote | ||
|
Wakefield Thermal | HEAT SINK PIN FIN... |
180 |
35,000
In-stock
|
Get Quote | ||
|
|
Malico Inc. | AL HEAT SINK 27X27X... |
1 |
35,000
In-stock
|
Get Quote |
