- Manufacturer：
-
- Aavid (22)
- CUI Devices (27)
- Seeed (6)
- T-Global Technology (23)
- Wakefield Thermal (218)
- Material Finish：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Product Status：
-
- Shape：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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402 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 1220... |
1 |
27
In-stock
|
Get Quote | ||
|
Aavid | 74765 EXTRUSION 1.025... |
1 |
83
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 10 ... |
1 |
3,205
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 14 ... |
1 |
3,326
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 23 ... |
1 |
1,287
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 27 ... |
1 |
1,713
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 12 ... |
1 |
1,689
In-stock
|
Get Quote | ||
|
|
Seeed | HEAT SINK KIT FOR... |
1 |
13,975
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 23 ... |
1 |
5,589
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 25 ... |
1 |
1,433
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 40 ... |
1 |
1,250
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
1 |
1,090
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 40 ... |
1 |
35,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | 2.875WX12" EXTRUSIO ... |
1 |
101
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK EXTRUSI... |
1 |
280
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | 1.625WX36" EXTRUSIO ... |
1 |
361
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK FOR PWR... |
1 |
132
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 300X... |
1 |
269
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK 16639 PROF... |
1 |
174
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK FOR PWR... |
1 |
136
In-stock
|
Get Quote |
