Package Cooled:
Power Dissipation @ Temperature Rise:
Product Status:
Thermal Resistance @ Natural:
Image Part Manufacturer Description MOQ Stock Action
HSB24-252510 CUI Devices
HEAT SINK, BGA,25 X...
1
1,358
In-stock
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ATS-PCB1028 Advanced Thermal Solutions, Inc.
HEATSINK CLIP-ON...
1
35,000
In-stock
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