- Manufacturer：
-
- Aavid (1)
- CUI Devices (26)
- Material Finish：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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27 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, BGA, 10 ... |
1 |
3,205
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 14 ... |
1 |
3,326
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 23 ... |
1 |
1,287
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 27 ... |
1 |
1,713
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 12 ... |
1 |
1,689
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 23 ... |
1 |
5,589
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 25 ... |
1 |
1,433
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 40 ... |
1 |
1,250
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 40 ... |
1 |
35,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA,25 X... |
1 |
1,358
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 33.... |
1 |
1,194
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 23 ... |
1 |
1,202
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 43.... |
1 |
1,081
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 18 ... |
1 |
780
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 35 ... |
1 |
700
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 27 ... |
1 |
239
In-stock
|
Get Quote | ||
|
|
Aavid | 61085 EXTRUSION 1.312... |
1 |
23
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 30.... |
1 |
524
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 21 ... |
1 |
35,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 21 ... |
1 |
35,000
In-stock
|
Get Quote |
