- Manufacturer：
-
- CUI Devices (1)
- Material：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Product Status：
-
- Thermal Resistance @ Natural：
-
7 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Wakefield Thermal | HEATSINK TO-220 VR... |
1 |
4,856
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
1,977
In-stock
|
Get Quote | ||
|
Wakefield Thermal | HEATSINK FOR TO21... |
1,000 |
35,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK FOR TO21... |
1,000 |
35,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK TO-220 W/S... |
1,000 |
35,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK TO-220 W/S... |
1,000 |
35,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK TO-220 VE... |
1 |
35,000
In-stock
|
Get Quote |
