- Manufacturer:
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- CUI Devices (2)
- Material:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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- Type:
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11 Records
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
1,118
In-stock
|
Get Quote | ||
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
999
In-stock
|
Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEAT SINK 35MM X 46... |
1 |
627
In-stock
|
Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEAT SINK 29MM X 37... |
1 |
66
In-stock
|
Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEAT SINK 35MM X 46... |
1 |
79
In-stock
|
Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEAT SINK 32MM X 50... |
1 |
61
In-stock
|
Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEAT SINK 32MM X 50... |
1 |
97
In-stock
|
Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEAT SINK 29MM X 37... |
1 |
52
In-stock
|
Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEAT SINK 25MM X 32... |
1 |
78
In-stock
|
Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEAT SINK 21MM X 45... |
1 |
74
In-stock
|
Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEAT SINK 28MM X 45... |
1 |
94
In-stock
|
Get Quote |