- Manufacturer：
-
- CUI Devices (5)
- Ohmite (4)
- Material Finish：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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9 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, EXTRUS... |
74 |
35,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1,500 |
35,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1,800 |
35,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1,350 |
35,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1,200 |
35,000
In-stock
|
Get Quote | ||
|
Ohmite | 220W 15 OHMS VIT COR... |
33 |
33
In-stock
|
Get Quote | ||
|
|
Ohmite | 220W 16 OHMS VIT COR... |
16 |
16
In-stock
|
Get Quote | ||
|
|
Ohmite | 220 WATT .67 OHMS 10% |
2 |
2
In-stock
|
Get Quote | ||
|
|
Ohmite | 240W 0.5 OHMS VIT CO... |
1 |
1
In-stock
|
Get Quote |
