- Manufacturer:
-
- Aavid (1)
- CTS Corporation (229)
- CUI Devices (120)
- iWave Systems (3)
- Malico Inc. (21)
- Ohmite (58)
- Seeed (3)
- Wakefield Thermal (91)
- Attachment Method:
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- Material Finish:
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- Package Cooled:
-
- Power Dissipation @ Temperature Rise:
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- Product Status:
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- Shape:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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596 Records
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
|
NTE Electronics, Inc. | HEAT SINK PLAST.P... |
1 |
184
In-stock
|
Get Quote | ||
|
NTE Electronics, Inc. | CLIP-ON H/S FOR 24P... |
1 |
96
In-stock
|
Get Quote | ||
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
610
In-stock
|
Get Quote | ||
|
CUI Devices | HEAT SINK, BGA, 30.... |
1 |
524
In-stock
|
Get Quote | ||
|
NTE Electronics, Inc. | HEATSINK FOR TO22... |
1 |
240
In-stock
|
Get Quote | ||
|
NTE Electronics, Inc. | HEATSINK FOR PLA... |
1 |
74
In-stock
|
Get Quote | ||
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
990
In-stock
|
Get Quote | ||
|
NTE Electronics, Inc. | HEAT SINK-TO-5 TRA... |
1 |
16
In-stock
|
Get Quote | ||
|
NTE Electronics, Inc. | HEAT SINK |
1 |
32
In-stock
|
Get Quote | ||
|
NTE Electronics, Inc. | HEAT SINK |
1 |
54
In-stock
|
Get Quote | ||
|
TE Connectivity AMP Connectors | HEATSINK ASSEMBL... |
1 |
25
In-stock
|
Get Quote | ||
![]() |
Ohmite | HEATSINK, FLAT BA... |
399 |
399
In-stock
|
Get Quote | ||
![]() |
Ohmite | 175MM LG BLK ANODI... |
91 |
91
In-stock
|
Get Quote | ||
![]() |
Ohmite | HEATSINK 6" L, UNF... |
11 |
11
In-stock
|
Get Quote | ||
|
iWave Systems | ZU+ZU7/ZU5/ZU4 MPSO... |
1 |
10
In-stock
|
Get Quote | ||
|
iWave Systems | ARRIA10 SOC SOM FA... |
1 |
10
In-stock
|
Get Quote | ||
|
iWave Systems | ZU+ ZU19/17/11 MPSOC ... |
1 |
10
In-stock
|
Get Quote | ||
|
CUI Devices | HEAT SINK, BGA, 21 ... |
1 |
35,000
In-stock
|
Get Quote | ||
|
CUI Devices | HEAT SINK, BGA, 21 ... |
1 |
35,000
In-stock
|
Get Quote | ||
|
CUI Devices | HEAT SINK, BGA, 17 ... |
1 |
35,000
In-stock
|
Get Quote |