- Manufacturer：
-
- Aavid (1)
- CTS Corporation (229)
- CUI Devices (120)
- iWave Systems (3)
- Malico Inc. (21)
- Ohmite (58)
- Seeed (3)
- Wakefield Thermal (91)
- Attachment Method：
-
- Material Finish：
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- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
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- Product Status：
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- Shape：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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596 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
14
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 45 ... |
1 |
35,000
In-stock
|
Get Quote | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
1 |
35,000
In-stock
|
Get Quote | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
1 |
35,000
In-stock
|
Get Quote | ||
|
|
Ohmite | BGA HEATSINK W/TA... |
1 |
35,000
In-stock
|
Get Quote | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
1 |
35,000
In-stock
|
Get Quote | ||
|
|
Seeed | ALUMINUM ALLOY C... |
1 |
1
In-stock
|
Get Quote | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
1 |
35,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | ANCHOR HEATSINK ... |
1 |
35,000
In-stock
|
Get Quote | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
1 |
35,000
In-stock
|
Get Quote | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
1 |
5
In-stock
|
Get Quote | ||
|
|
Ohmite | BGA HEATSINK W/TA... |
1 |
2
In-stock
|
Get Quote | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
1 |
22
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | FANSINK 5VDC 50X50X... |
1 |
5
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | FANSINK 12VDC 55X55... |
1 |
5
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 8.5... |
1 |
35,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
35,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 17 ... |
1 |
35,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 20 ... |
1 |
35,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
35,000
In-stock
|
Get Quote |
