- Manufacturer：
-
- Aavid (1)
- CTS Corporation (229)
- CUI Devices (120)
- iWave Systems (3)
- Malico Inc. (21)
- Ohmite (58)
- Seeed (3)
- Wakefield Thermal (91)
- Attachment Method：
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- Material Finish：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Product Status：
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- Shape：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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596 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
ASSMANN WSW Components | HEATSINK CPU FOR... |
1 |
1,574
In-stock
|
Get Quote | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
1 |
126
In-stock
|
Get Quote | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
1 |
146
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | ANCHOR HEATSINK ... |
1 |
829
In-stock
|
Get Quote | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
1 |
129
In-stock
|
Get Quote | ||
|
|
Ohmite | BGA HEATSINK W/TA... |
1 |
150
In-stock
|
Get Quote | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
1 |
230
In-stock
|
Get Quote | ||
|
|
Ohmite | BGA HEATSINK W/TA... |
1 |
167
In-stock
|
Get Quote | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
1 |
625
In-stock
|
Get Quote | ||
|
|
Ohmite | BGA HEATSINK W/TA... |
1 |
520
In-stock
|
Get Quote | ||
|
|
Seeed | ALUMINUM HEATSIN... |
1 |
252
In-stock
|
Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK CPU STA... |
1 |
5,233
In-stock
|
Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK CPU STA... |
1 |
2,249
In-stock
|
Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK CPU STA... |
1 |
2,204
In-stock
|
Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK CPU STA... |
1 |
2,249
In-stock
|
Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK CPU STA... |
1 |
2,267
In-stock
|
Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK CPU STA... |
1 |
2,247
In-stock
|
Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK CPU STA... |
1 |
2,249
In-stock
|
Get Quote | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
1 |
196
In-stock
|
Get Quote | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
1 |
107
In-stock
|
Get Quote |
