- Manufacturer：
-
- Aavid (1)
- CTS Corporation (229)
- CUI Devices (120)
- iWave Systems (3)
- Malico Inc. (21)
- Ohmite (58)
- Seeed (3)
- Wakefield Thermal (91)
- Attachment Method：
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- Material Finish：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Product Status：
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- Shape：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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596 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, BGA, 35 ... |
1 |
700
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 27 ... |
1 |
239
In-stock
|
Get Quote | ||
|
|
Ohmite | BGA HEATSINK W/TA... |
1 |
98
In-stock
|
Get Quote | ||
|
Ohmite | ALUMINUM EXTRUSI... |
1 |
84
In-stock
|
Get Quote | ||
|
|
Aavid | 61085 EXTRUSION 1.312... |
1 |
23
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
703
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | ANCHOR HEATSINK ... |
1 |
312
In-stock
|
Get Quote | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
1 |
91
In-stock
|
Get Quote | ||
|
|
Ohmite | BGA HEATSINK W/TA... |
1 |
42
In-stock
|
Get Quote | ||
|
|
Ohmite | BGA HEATSINK W/TA... |
1 |
46
In-stock
|
Get Quote | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
1 |
72
In-stock
|
Get Quote | ||
|
|
Ohmite | BGA HEATSINK W/TA... |
1 |
27
In-stock
|
Get Quote | ||
|
|
Seeed | ALUMINUM ALLOY C... |
1 |
22
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | FANSINK 5VDC 47.5X4... |
1 |
39
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | FANSINK 5VDC 47.5X4... |
1 |
31
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | FANSINK 12VDC 55X55... |
1 |
94
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | FANSINK 5VDC 47.5X4... |
1 |
22
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | FANSINK 5VDC 47.5X4... |
1 |
23
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | FANSINK 5VDC 50X50X... |
1 |
16
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | FANSINK 12VDC 55X55... |
1 |
30
In-stock
|
Get Quote |
