- Manufacturer：
-
- CUI Devices (23)
- iWave Systems (3)
- Ohmite (42)
- Seeed (3)
- Wakefield Thermal (33)
- Attachment Method：
-
- Material Finish：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Product Status：
-
- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
-
118 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
15,288
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
2,208
In-stock
|
Get Quote | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
1 |
3,194
In-stock
|
Get Quote | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
1 |
1,499
In-stock
|
Get Quote | ||
|
|
Ohmite | ALUMINUM EXTRUSI... |
1 |
144
In-stock
|
Get Quote | ||
|
Ohmite | ALUMINUM EXTRUSI... |
1 |
236
In-stock
|
Get Quote | ||
|
|
Ohmite | ALUMINUM EXTRUSI... |
1 |
77
In-stock
|
Get Quote | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
1 |
126
In-stock
|
Get Quote | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
1 |
146
In-stock
|
Get Quote | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
1 |
129
In-stock
|
Get Quote | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
1 |
230
In-stock
|
Get Quote | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
1 |
625
In-stock
|
Get Quote | ||
|
|
Seeed | ALUMINUM HEATSIN... |
1 |
252
In-stock
|
Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK CPU STA... |
1 |
5,233
In-stock
|
Get Quote | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
1 |
196
In-stock
|
Get Quote | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
1 |
107
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
2,987
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
2,355
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
2,657
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
3,000
In-stock
|
Get Quote |
