- Manufacturer：
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- CUI Devices (12)
- Wakefield Thermal (39)
- Attachment Method：
-
- Material Finish：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Product Status：
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- Shape：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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59 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
15,288
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | ANCHOR HEATSINK ... |
1 |
829
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | ANCHOR HEATSINK ... |
1 |
933
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | ANCHOR HEATSINK ... |
1 |
884
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | ANCHOR HEATSINK ... |
1 |
1,005
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | ANCHOR HEATSINK ... |
1 |
192
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | ANCHOR HEATSINK ... |
1 |
142
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | ANCHOR HEATSINK ... |
1 |
977
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | ANCHOR HEATSINK ... |
1 |
504
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | ANCHOR HEATSINK ... |
1 |
684
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | ANCHOR HEATSINK ... |
1 |
191
In-stock
|
Get Quote | ||
|
|
NTE Electronics, Inc. | HEAT SINK-PLAST. ... |
1 |
172
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
3,230
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
1,197
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
1,118
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
992
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
999
In-stock
|
Get Quote | ||
|
|
NTE Electronics, Inc. | HEAT SINK-TO-3 TRA... |
1 |
1,072
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | ANCHOR HEATSINK ... |
1 |
312
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | ANCHOR HEATSINK ... |
1 |
986
In-stock
|
Get Quote |
