- Manufacturer：
-
- CUI Devices (68)
- Ohmite (36)
- Wakefield Thermal (10)
- Attachment Method：
-
- Material Finish：
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- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
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- Shape：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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118 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
2,893
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
2,208
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
1,944
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
1,262
In-stock
|
Get Quote | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
1 |
3,194
In-stock
|
Get Quote | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
1 |
1,499
In-stock
|
Get Quote | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
1 |
126
In-stock
|
Get Quote | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
1 |
146
In-stock
|
Get Quote | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
1 |
129
In-stock
|
Get Quote | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
1 |
230
In-stock
|
Get Quote | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
1 |
625
In-stock
|
Get Quote | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
1 |
196
In-stock
|
Get Quote | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
1 |
107
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
2,870
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
2,500
In-stock
|
Get Quote | ||
|
|
NTE Electronics, Inc. | HEATSINK FOR PLA... |
1 |
1,312
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
2,215
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
4,828
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
1,606
In-stock
|
Get Quote |
