- Manufacturer：
-
- CUI Devices (4)
- Malico Inc. (21)
- Wakefield Thermal (57)
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
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- Shape：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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82 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Wakefield Thermal | ANCHOR HEATSINK ... |
1 |
829
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | ANCHOR HEATSINK ... |
1 |
933
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | ANCHOR HEATSINK ... |
1 |
884
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | ANCHOR HEATSINK ... |
1 |
1,005
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | ANCHOR HEATSINK ... |
1 |
192
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | ANCHOR HEATSINK ... |
1 |
142
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | ANCHOR HEATSINK ... |
1 |
977
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | ANCHOR HEATSINK ... |
1 |
504
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | ANCHOR HEATSINK ... |
1 |
684
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | ANCHOR HEATSINK ... |
1 |
191
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
1,197
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
1,118
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
992
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
999
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | ANCHOR HEATSINK ... |
1 |
312
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | FANSINK 5VDC 47.5X4... |
1 |
39
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | FANSINK 5VDC 47.5X4... |
1 |
31
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | FANSINK 12VDC 55X55... |
1 |
94
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | FANSINK 5VDC 47.5X4... |
1 |
22
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | FANSINK 5VDC 47.5X4... |
1 |
23
In-stock
|
Get Quote |
