- Manufacturer：
-
- CUI Devices (1)
- Material Finish：
-
- Power Dissipation @ Temperature Rise：
-
- Product Status：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Type：
-
2 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, BGA, 28.... |
1 |
1,704
In-stock
|
Get Quote | ||
|
|
TE Connectivity AMP Connectors | HEATSINK ASSEMBL... |
1 |
25
In-stock
|
Get Quote |
