- Manufacturer：
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- CUI Devices (1)
- Attachment Method：
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- Material：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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6 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
2,893
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK 21X12MM S... |
1 |
444
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK 21X12MM F... |
1 |
66
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 40MM X 30... |
1 |
3
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 40MM X 30... |
1 |
23
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK 21X12MM D... |
1 |
5
In-stock
|
Get Quote |
