- Manufacturer：
-
- CTS Corporation (1)
- Ohmite (57)
- Attachment Method：
-
- Material：
-
- Package Cooled：
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- Power Dissipation @ Temperature Rise：
-
- Product Status：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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154 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Ohmite | HEATSINK AND CLI... |
1 |
35,000
In-stock
|
Get Quote | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
1 |
22
In-stock
|
Get Quote | ||
|
|
Ohmite | HEATSINK AND CLI... |
1 |
35,000
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | PCIE EXTRUSION P... |
1 |
2
In-stock
|
Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 1220... |
1 |
10
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 1220... |
1 |
10
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 1220... |
1 |
35,000
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | PCIE EXTRUSION P... |
1 |
35,000
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 1220... |
1 |
3
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 1220... |
1 |
10
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 1220... |
1 |
3
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 1220... |
1 |
10
In-stock
|
Get Quote | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
1 |
35,000
In-stock
|
Get Quote | ||
|
|
Ohmite | HEATSINK FOR TO-2... |
1 |
35,000
In-stock
|
Get Quote | ||
|
|
Ohmite | TO-268 HEAT SINK /P... |
250 |
35,000
In-stock
|
Get Quote | ||
|
|
Ohmite | HEATSINK D2PAK TO... |
200 |
35,000
In-stock
|
Get Quote | ||
|
|
Ohmite | HEATSINK 27MM DEG... |
1,200 |
35,000
In-stock
|
Get Quote | ||
|
|
Ohmite | EXTRUDED HEATSIN... |
1,200 |
35,000
In-stock
|
Get Quote | ||
|
|
Ohmite | HEATSINK 55MM DEG... |
1,120 |
35,000
In-stock
|
Get Quote | ||
|
|
Ohmite | EXTRUDED HEATSIN... |
1,120 |
35,000
In-stock
|
Get Quote |
