- Attachment Method：
-
- Material Finish：
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- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Product Status：
-
- Shape：
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- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Filter：
173 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
3,230
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
1,542
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
1,582
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 37.... |
1 |
665
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
1,197
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
1,118
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 43.... |
1 |
1,081
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
1,572
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
992
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
999
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 60 ... |
1 |
223
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 2.6W... |
1 |
545
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
605
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
960
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 18 ... |
1 |
780
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
646
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 35 ... |
1 |
700
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 27 ... |
1 |
239
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 5.1W... |
1 |
712
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
703
In-stock
|
Get Quote |
