- Attachment Method：
-
- Material Finish：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Product Status：
-
- Shape：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Filter：
173 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK TO-263 CO... |
150 |
300
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 2.9W... |
1 |
315
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 2.9W... |
1 |
214
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 2.3W... |
1 |
129
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 2.6W... |
1 |
415
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 2.9W... |
1 |
283
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 4.2W... |
1 |
166
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 5.1W... |
1 |
117
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 4.2W... |
1 |
323
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 4.1W... |
1 |
333
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 4.7W... |
1 |
750
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 4.1W... |
1 |
376
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
610
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 30.... |
1 |
524
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
433
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
990
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 21 ... |
1 |
35,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 21 ... |
1 |
35,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 17 ... |
1 |
35,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
14
In-stock
|
Get Quote |
