- Attachment Method:
-
- Material Finish:
-
- Package Cooled:
-
- Power Dissipation @ Temperature Rise:
-
- Product Status:
-
- Shape:
-
- Thermal Resistance @ Forced Air Flow:
-
- Thermal Resistance @ Natural:
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- Filter:
173 Records
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
35,000
In-stock
|
Get Quote | ||
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
35,000
In-stock
|
Get Quote | ||
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
35,000
In-stock
|
Get Quote | ||
|
CUI Devices | HEAT SINK, EXTRUS... |
33 |
35,000
In-stock
|
Get Quote | ||
|
CUI Devices | HEAT SINK, BGA, 40 ... |
1 |
35,000
In-stock
|
Get Quote | ||
|
CUI Devices | HEAT SINK, EXTRUS... |
18 |
35,000
In-stock
|
Get Quote | ||
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
35,000
In-stock
|
Get Quote | ||
|
CUI Devices | HEAT SINK, BGA, 35 ... |
1 |
35,000
In-stock
|
Get Quote | ||
|
CUI Devices | HEATSINK TO-220 4.1W... |
8,000 |
35,000
In-stock
|
Get Quote | ||
|
CUI Devices | HEATSINK TO-220 3.6W... |
4,000 |
35,000
In-stock
|
Get Quote | ||
|
CUI Devices | HEATSINK TO-220 2.3W... |
3,000 |
35,000
In-stock
|
Get Quote | ||
|
CUI Devices | HEATSINK TO-220 3.6W... |
10,000 |
35,000
In-stock
|
Get Quote | ||
|
CUI Devices | HEAT SINK, EXTRUS... |
2,500 |
35,000
In-stock
|
Get Quote | ||
|
CUI Devices | HEAT SINK, EXTRUS... |
2,500 |
35,000
In-stock
|
Get Quote | ||
|
CUI Devices | HEATSINK TO-220 2.9W... |
1,000 |
35,000
In-stock
|
Get Quote | ||
|
CUI Devices | HEAT SINK, EXTRUS... |
1,000 |
35,000
In-stock
|
Get Quote | ||
|
CUI Devices | HEATSINK TO-220 4.4W... |
4,000 |
35,000
In-stock
|
Get Quote | ||
|
CUI Devices | HEATSINK TO-220 3.6W... |
10,000 |
35,000
In-stock
|
Get Quote | ||
|
CUI Devices | HEATSINK TO-220 4.4W... |
3,000 |
35,000
In-stock
|
Get Quote | ||
|
CUI Devices | HEATSINK TO-220 3.9W... |
4,000 |
35,000
In-stock
|
Get Quote |