- Manufacturer:
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- Backing, Carrier:
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- Outline:
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- Shape:
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- Thermal Conductivity:
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10 Records
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
|
NTE Electronics, Inc. | THERMAL INTERFAC... |
1 |
911
In-stock
|
Get Quote | ||
|
Sensata Technologies – Crydom | THERM PAD 57.15MMX4... |
1 |
810
In-stock
|
Get Quote | ||
|
Sensata Technologies – Crydom | THERM PAD 33.78MMX1... |
1 |
30
In-stock
|
Get Quote | ||
|
Bergquist / Henkel | THERM PAD 406.4MMX2... |
1 |
6
In-stock
|
Get Quote | ||
|
Bergquist / Henkel | THERM PAD 406.4MMX2... |
1 |
7
In-stock
|
Get Quote | ||
|
Bergquist / Henkel | THERM PAD 406.4MMX2... |
1 |
2
In-stock
|
Get Quote | ||
|
Sensata Technologies – Crydom | THERM PAD 104.39MMX... |
1 |
4
In-stock
|
Get Quote | ||
|
Bergquist / Henkel | THERM PAD 406.4MMX2... |
1 |
1
In-stock
|
Get Quote | ||
|
Bergquist / Henkel | THERM PAD 406.4MMX2... |
5 |
35,000
In-stock
|
Get Quote | ||
|
Bergquist / Henkel | THERM PAD 406.4MMX2... |
4 |
35,000
In-stock
|
Get Quote |